We will exhibit as follows and hope visiting our booth to view our products!

Exhibited products:
Ultra-small springs with diameters of 0.1 to 0.02mm, Ultra-precision springs, Non-magnetic springs, Springs that are difficult to process;
Ultra-small/thin engineering plastic components, Engineering plastic screws, Engineering plastic springs;
High-end needle tubes/needle shafts for probes, Springs for ultra-small probes;
Ultra-small terminals, Micron-level ultra-precision machining components, Ultra-precision non-magnetic machining components;
PEEK ultra-fine tubes, Engineering plastic bearings, Titanium alloy fasteners, High-end Japanese-made fasteners, and more.

SEMI-e is an exhibition for semiconductor technology and applications.
Exhibits will cover the entire industry chain, including chip design, wafer manufacturing and packaging, new displays (Mini/Micro-LED), semiconductor-specific equipment, third-generation semiconductors, electronic components, machine vision, and sensors.

Booth number: 6F35

6th SEMI-e Shenzhen International Semiconductor Technology and Application Exhibition
Date: June 26th to 28th, 2024
Venue: Shenzhen International Convention and Exhibition Center (Bao'an New Hall)
http://www.sz-semiconductor.com/